Wuhan Fengfan Chemical/Trading Co., Ltd

Electroplating Intermediates

	INTERMEDIATES FOR Ni,Zn,Cu PLATING ADDITIVES

Brand Name

FENGFAN

1. For Nickel Plating: CAS NO.
Propynol ethoxylate (PME) 3973-18-0
Propynesulfonic acid sodium salt (PS) 55947-46-1
Propargyl alcohol propoxylate (PAP) 3973-17-9
Hydroxymethanesulfonic acid monosodium salt (PN) 870-72-4
2-Ethylhexysulphate (TC-EHS) 126-92-1
Propargyl-oxo-propane-2, 3-dihydroxy (POPDH) 5425-78-5
Pyridinium hydroxy propyl sulfobetaine (PPS-OH40%,50%) 3918-73-8
1-Diethylamino-2-propyne (DEP) 4079-68-9
Diethylaminopropyne formate (PABS) 125678-52-6
Carboxyethylisothiuronium chloride (ATP) 871-62-5
Butynediol ethoxylate (BEO) 1606-85-5
Butynediol propoxylate (BMP) 1606-79-7
Bis(benzene sulphonyl)-imide (BBI) 2618-96-4
Sodium allyl sulfonate (ALS / SAS 25% & 35%) 2495-39-8
2.5-dimethyl-2.5-hexynediol (HD-M) 142-30-3
Butynyl Chlorohydrinether Sulfonate (BCES) 67874-62-8
Reaction products of 2-butyne-1, 4-diol with Epichlorohydrin (BEH) 68876-96-0
1-Proanaminium, 3-{ [( heptadecafluorooctyl ) sulfonyl ] - amino } -N,
N-dimethyl-N-(3-sulfopropyl)-inner salt (FAS) 83038-19-1

2. For Copper Plating:
2-meracapto-benzimidazole (M) 583-39-1
Ethenethiourea (N) 96-45-7
Aqueous of cross-linking polyamide (JPH)
2-mercapto thiazoline (H1) 96-53-7

3. For Cyanide Zinc Plating:
Cationic polymer in water (IME) 68797-57-9
Sodium salt of di (1-benzyl-3-carboxyl-1.2-dihydro pyridyl-2) ether (BPE)
1-benzyl-3-carboxyl pyridinium chloride (BCPC) 16214-98-5
1- Benzyl pyridinium - 3 - carboxylate (BPC 34%,48%) 15990-43-9
Cationic polymer in water (MOME) 109882-76-0
N,N,N,' N' -tetra(2-hydropropayl) ethylene diamine (EDTP) 102-60-3

4. For Acidic Zinc Plating:
OCBA (O-Chlorobenzaldehyde)
Benzylidene acetone
TC-EHS (as Carrier)